发明名称 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
摘要 PURPOSE: A substrate processing apparatus and a substrate processing method are provided to smoothly load and unload a substrate and improve cleaning efficiency. CONSTITUTION: A substrate processing apparatus for processing a substrate with a processing liquid fed to the substrate comprises: a holding member for holding the substrate; and a lower side member which is movable relatively with respect to an undersurface of the substrate held by the holding member between a processing position near the undersurface of the substrate and a retreat position remote from the undersurface of the substrate, the processing liquid being fed to a space between an upper surface of the lower side member moved to the processing position and the undersurface of the substrate held by the holding member to process the undersurface of the substrate.
申请公布号 KR20020062703(A) 申请公布日期 2002.07.29
申请号 KR20020003783 申请日期 2002.01.23
申请人 TOKYO ELECTRON LIMITED 发明人 ORII TAKEHIKO;TOSHIMA TAKAYUKI
分类号 H01L21/304;B08B3/04;B08B3/10;H01L21/00;(IPC1-7):H01L21/304 主分类号 H01L21/304
代理机构 代理人
主权项
地址