发明名称 POWER ELECTRONICS COMPONENT WITH IMPROVED THERMAL PROPERTIES
摘要 A power electronics component having a housing a cover plate and an electrically active region. The electrically active region is disposed in the housing in such manner that a gap exists between the electrically active region and the inner wall of the housing. The gap is filled with a moisture absorbent bulk granular material.
申请公布号 HU0200925(A2) 申请公布日期 2002.07.29
申请号 HU20020000925 申请日期 2000.04.07
申请人 EPCOS AG. 发明人 VETTER HARALD
分类号 H01G4/224;H01G2/12;H01L23/00;H01L23/373;H01L23/42 主分类号 H01G4/224
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