THINNING TREATMENT METHOD OF SEMICONDUCTOR WAFER

摘要

PROBLEM TO BE SOLVED: To provide a thinning treatment method of a semiconductor wafer wherein damages are not produced on a semiconductor wafer in a treatment process. SOLUTION: In this thinning treatment method of a semiconductor wafer, a semiconductor wafer 10, after a circuit has been formed, is thinned. After the back of a circuit forming surface of the semiconductor wafer 19 is eliminated by mechanical polishing, a stress layer generated by the polishing is eliminated, and the thinned semiconductor wafer 10 after the stress layer is eliminated is struck on an adhesive sheet 27 attached on a sheet frame 26. The sheet frame 26 on which the semiconductor wafer 10 is stuck is accommodated in a frame cassette 29. As a result, the shape of the semiconductor wafer 10 which is thinned and brittle is held, and breakdown can be prevented, by protecting the semiconductor wafer 10 from external force, when it is handled.