发明名称 INDIRECT EVAPORATIVE COOLING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an indirect vaporization cooling device, in which even when water-spray quantity is limited to change a cooling capacity, there arises no problem of accumulation of impurities in a heat exchanger. SOLUTION: In the indirect evaporative cooling device, water is sprayed in a first fluid path 2 of the heat exchanger 1 having a plurality of fluid paths to cool a fluid in a second fluid path 3. In this case, water-spray area is made variable so as to be decided in accordance with a required cooling capacity, and water is sprayed partly in the path 2.
申请公布号 JP2002206834(A) 申请公布日期 2002.07.26
申请号 JP20000401860 申请日期 2000.12.28
申请人 SEIBU GIKEN CO LTD 发明人 OKANO HIROSHI
分类号 F25D7/00;F24F1/00;F24F1/02;F28D5/00;(IPC1-7):F25D7/00 主分类号 F25D7/00
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