发明名称 |
TRANSPORTATION-TYPE SUBSTRATE TREATMENT DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a transportation-type substrate treatment device where the side edge face of an Al layer is formed in a gentle inclined face fitted to the lamination of a next layer by applying it to Al etching. SOLUTION: Slit nozzles 35 supplying treatment liquid in the whole area of a width direction on the surface of a substrate in a film shape are arranged in one stage or a plurality of stages on the down stream side of a shower unit 34 supplying treatment liquid to the whole surface of the substrate 100 from many spray nozzles 34a. A paddle state where treatment liquid is thinly loaded on the surface of the substrate 100 is realized by a chemical knife treatment by using the slit nozzles 35.
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申请公布号 |
JP2002208582(A) |
申请公布日期 |
2002.07.26 |
申请号 |
JP20000375993 |
申请日期 |
2000.12.11 |
申请人 |
SUMITOMO PRECISION PROD CO LTD |
发明人 |
SHIMODA KYOJI;TAUCHI HITOSHI |
分类号 |
G02F1/13;B05B1/02;B05D1/02;B05D7/00;C23F1/08;H01L21/00;H01L21/027;H01L21/306;(IPC1-7):H01L21/306 |
主分类号 |
G02F1/13 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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