发明名称 TRANSPORTATION-TYPE SUBSTRATE TREATMENT DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a transportation-type substrate treatment device where the side edge face of an Al layer is formed in a gentle inclined face fitted to the lamination of a next layer by applying it to Al etching. SOLUTION: Slit nozzles 35 supplying treatment liquid in the whole area of a width direction on the surface of a substrate in a film shape are arranged in one stage or a plurality of stages on the down stream side of a shower unit 34 supplying treatment liquid to the whole surface of the substrate 100 from many spray nozzles 34a. A paddle state where treatment liquid is thinly loaded on the surface of the substrate 100 is realized by a chemical knife treatment by using the slit nozzles 35.
申请公布号 JP2002208582(A) 申请公布日期 2002.07.26
申请号 JP20000375993 申请日期 2000.12.11
申请人 SUMITOMO PRECISION PROD CO LTD 发明人 SHIMODA KYOJI;TAUCHI HITOSHI
分类号 G02F1/13;B05B1/02;B05D1/02;B05D7/00;C23F1/08;H01L21/00;H01L21/027;H01L21/306;(IPC1-7):H01L21/306 主分类号 G02F1/13
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