| 摘要 |
PROBLEM TO BE SOLVED: To suppress the occurrence of cracks, blister/delamination, and voids into a bonding layer in the case where a plated composite material is bonded to another object using a bonding layer such as soft-solder layer. SOLUTION: After pretreatment is applied to a composite material, a metallic catalyst is supplied to the surface of the composite material and then nickel-P electroless plating treatment is applied to the surface of the composite material. In this treatment, a plating layer having a thickness at which the removal by vaporization of residual liquid remaining at the composite material can be facilitated is formed on the surface of the composite material. Subsequently, drying treatment is applied to the composite material on which the plating layer is formed, and then the surface of the plating layer is subjected to activation treatment.
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