OBJECT PLATING METHOD AND SYSTEM

摘要

PROBLEM TO BE SOLVED: To provide a plating method and system which make the by-product concentration and/or plating component concentration in a plating cell nearly constant. SOLUTION: At least one condition relating to plating is monitored and the amount of at least one by-product formed during plating and the decrease of at least plating component are determined. In accordance with the monitored condition, the flow rate of the materials to be added to the plating cell and/or the flow rate of the used plating materials discharge from the plating cell is adjusted. The used plating materials are cleaned in order to remove at least several by-products and the cleaned plating materials are integrated with at least one component and are returned into the plating cell. At least several of the plating materials are reused. This method and system are usable when semiconductor wafers are subjected to copper plating.