发明名称 ELECTRONIC COMPONENT MOUNTING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a reliable electronic component mounting device that can achieve mounting onto the board of electronic components in various shapes at low costs. SOLUTION: A tip section 28 comprises base 44 where a middle port 42 for communicating with a negative pressure supply port 24 is formed, and adaptors 46, 48, and 50 that are detachably and selectively fitted to the base 44. A suction port 26 consists of the adaptors 46, 48, and 50 so that the suction port 26 communicates with the middle port 42. At the same time, the adaptors 46, 48, and 50 have an electronic component suction nozzle 12 where the suction port 26 having a mutually different shape is formed in the electronic component mounting device.
申请公布号 JP2002208799(A) 申请公布日期 2002.07.26
申请号 JP20010005006 申请日期 2001.01.12
申请人 JUKI CORP 发明人 MATSUTANI KAZUHIRO
分类号 H05K13/04 主分类号 H05K13/04
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