| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having mechanical strength, adhesiveness, chemical resistance and flexibility and significantly improved durability against plating and to provide a photosensitive element which uses the above composition. SOLUTION: The photosensitive resin composition and the photosensitive element which uses the above composition contain (A) a binder polymer having carboxyl groups, (B) a photopolymerizable compound having a polymerizable ethylenically unsaturated group in the molecule, (C) a photoinitiator and (D) a dicyandiamide. The component (B) contains a compound expressed by general formula (I) as an essential component. In formula (I), R1 is a bivalent organic group and R2 is expressed by general formula (II). In formula (II), R3 is a hydrogen atom or a methyl group, X is an alkylene oxide group and n is an integer of 1 to 14. |
