METHOD FOR REMOVAL OF SURFACE ROUGHNESS OF METAL WIRING AND METHOD FOR FORMATION OF METAL WIRING ONTO TFT ARRAY

摘要

PROBLEM TO BE SOLVED: To effectively remove surface roughness formed on the surface of a metal wring after a wet etching operation in a semiconductor manufacturing process. SOLUTION: A tetramethylammonium hydroxide(TMAH) solution is applied to the rough surface of the metal wiring, and it is placed still for a prescribed time. After that, the metal interconnection is cleaned, and the TMAH solution left on the surface of the metal wiring is removed.