| 发明名称 |
METHOD FOR MANUFACTURING CIRCUIT BOARD |
| 摘要 |
PROBLEM TO BE SOLVED: To prevent deviation of a circuit pattern on a circuit board which uses a lead frame. SOLUTION: A sheet 1 is piled up in the state of inserting a positioning pin 4a to the hole 3d of the lead frame 3, and the lead frame 3 and the sheet 1 are molded integrally. |
| 申请公布号 |
JP2002208666(A) |
申请公布日期 |
2002.07.26 |
| 申请号 |
JP20010003311 |
申请日期 |
2001.01.11 |
| 申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
SUZUMURA MASAKI;OKAWA TAKAAKI;HIRANO KOICHI;TANAKA SHINYA |
| 分类号 |
H01L23/50;(IPC1-7):H01L23/50 |
主分类号 |
H01L23/50 |
| 代理机构 |
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