发明名称 |
CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To prevent short-circuiting of a lead frame and a heat radiation plate on a circuit board which uses the lead frame. SOLUTION: The punching direction of the lead frame 3 is set to the direction opposite to that of the heat radiation plate 5. In such a manner, even if burrs are generated due to punching, they are not short-circuited to the heat radiation plate 5 through a sheet 1. |
申请公布号 |
JP2002208667(A) |
申请公布日期 |
2002.07.26 |
申请号 |
JP20010003312 |
申请日期 |
2001.01.11 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
SUZUMURA MASAKI;OKADA KAZUO;HIRANO KOICHI |
分类号 |
H01L23/50;(IPC1-7):H01L23/50 |
主分类号 |
H01L23/50 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|