发明名称 CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To prevent short-circuiting of a lead frame and a heat radiation plate on a circuit board which uses the lead frame. SOLUTION: The punching direction of the lead frame 3 is set to the direction opposite to that of the heat radiation plate 5. In such a manner, even if burrs are generated due to punching, they are not short-circuited to the heat radiation plate 5 through a sheet 1.
申请公布号 JP2002208667(A) 申请公布日期 2002.07.26
申请号 JP20010003312 申请日期 2001.01.11
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 SUZUMURA MASAKI;OKADA KAZUO;HIRANO KOICHI
分类号 H01L23/50;(IPC1-7):H01L23/50 主分类号 H01L23/50
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