| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package wherein, when applying screws to the screwing portions of a heat radiating metal plate used for the semiconductor package, the radiating metal plate can be screwed to a fastening member, without removing completely the screws from the fastening member. SOLUTION: The semiconductor package 10 has in its central portion a mounting portion 16 for semiconductor electronic components, and has the screwing portions comprising first and second U-shaped notches 18, 19 respectively on both the sides of a radiating metal plate 11 which is substantially rectangular, when observing the radiating metal plate 11 in plan view. In the semiconductor package 10, an opened-side end portion 25 of the first U-shaped notch 18 is formed into a longitudinal one-end portion 24 of the radiating metal plate 11. The second U-shaped notch 19 is substantially orthogonal to the first U-shaped notch 18, and an opened-side end portion 27 of the second U-shaped notch 19 is formed in a lateral one-end portion 26 of the radiating metal plate 11. |
