| 摘要 |
PROBLEM TO BE SOLVED: To provide a soldering apparatus for a heat-generating chip electronic component by which a satisfactory heat dissipation and satisfactory soldering can be ensured by effectively preventing the outflow of cream solder. SOLUTION: A power transistor 11 is soldered to, and mounted on, lands 13, 14, 15 on a printed-wiring board 12. The land 15 on which the body 11a of the power transistor 11 is mounted is provided with a mounting-land region 15a to which the cream solder is applied so as to solder the power transistor 11 and a heat-dissipating-land region 15b heat dissipation. A resist partition 17 by a resist is formed so as to partition the region 15a and the region 15b.
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