| 摘要 |
The invention concerns a method for making a semiconductor package and a semiconductor package containing integrated circuit chips having a front surface with electrical connection zones, wherein a first multilayer wafer (2) comprising an assembling surface (2a) is provided with an adhesive layer (8) and has feedthroughs (9); and a second wafer (3) has a recess (13) provided in an assembling surface (3a) fixed to the assembling surface of the first wafer through said adhesive layer; said chip (4) being arranged in said recess in a position such that its front surface is fixed to the assembling surface of the first wafer through said adhesive layer and its electrical connection zones are located opposite the feedthroughs of said first wafer, and the base of the recess of said second wafer being supported on the rear surface of the chip opposite the front surface. |
