| 摘要 |
PROBLEM TO BE SOLVED: To prevent the occurrence of a failure, such as a solder unmelting mode, solder whitening mode, etc., by making the temperatures of connection pads and solder balls at different positions uniform at the time of causing the solder balls and solder paste to reflow. SOLUTION: In a bump connection structure between electronic components 15 and a mounting substrate 14, the connection pads 16 of the components 15 are connected to the connection pads 11 of the substrate 14 by means of solder bumps, by causing the solder paste 13 applied to the connection pads 11 of the substrate 14 and the solder balls 12 formed on the connection pads 16 of the components 15 placed on the substrate 14 to reflow by heating the substrate 14 and components 15. The heat capacities of members in the bump connections are made larger, going toward the periphery of the components 15 and smaller as going toward the center of the components 15. |
