| 摘要 |
PROBLEM TO BE SOLVED: To provide a pressure-welding type semiconductor device that can increase capacity easily and can also contribute to the improvement in yields, and can prevent erroneous pressure-welding due to the positional deviation of a semiconductor chip. SOLUTION: A plurality of semiconductor chips 11 and 12 are arranged on the same plane without using any solder, and an insulating frame 16 having an opening at a position corresponding to each semiconductor chip is arranged at the main surface side of the semiconductor chip. A disc-type heat buffer plate 15 is arranged at the rear surface side of the semiconductor chip, and the main surface of each semiconductor chip in the opening of the insulating frame and the disc-type heat buffer plate are collectively pressure-welded by first and second pressure-welding electrode plates 27 and 28. Then, by pinching each semiconductor chip from upper and lower directions by the insulating frame and the disc-type heat buffer plate, and the positioning and fixing of each semiconductor chip in upper and lower directions are made. |
