| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board without generating standing wave or reflection at through hole and having high external connection reliability. SOLUTION: No standing wave or reflection is generated at a coaxial through hole 66. A field via 160 is disposed on an internal layer resin filler 64 filler in the internal layer through hole 66 through a lid plating layer 94. The field via 160 having strength to stand the stress due to metal filled in it even stressed by the difference of thermal expansion between a core substrate 30 and the internal layer resin filler 64 causes no separation between solder bumps 76U and 76D. |
