摘要 |
PROBLEM TO BE SOLVED: To execute ordinary etching to a board in which universal holes are made in order to eliminate a need of drilling and to form many interconnections. SOLUTION: A copper foil with a chemical-resistant material, a chemical- resistant adhesive material or a film is pasted on the board in which the universal holes are made. The dissolution of the copper foil due to a chemical coming through the holes is prevented. Even when the holes are made by etching, the many interconnections can be formed on the board.
|