| 摘要 |
PROBLEM TO BE SOLVED: To enable a tape-like parts transport device for semiconductor manufacturing apparatus for imparting a fixed tension to tape-like parts. SOLUTION: The tape-like parts transport device 10 has a first tape feeder 11 and a second tape feeder 12. The first tape feeder 11 has a tape feeding section 20 which imparts a feeding force to tape-like parts (tape-like substrate), a driving source 30 which drives the feeding section 20, and a resistance adding means 26 which adds feed resistance to the feeding section 20. The tape feeder 11 is also provided with a disconnecting/connecting means 40, which can connect and disconnect the driving source 30 to and from the tape feeding section 20. |
