发明名称 MOISTURE-CURABLE EPOXY RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide an epoxy resin composition capable of being cured with moisture at the normal temperature and a low temperature, having excellent preservation stability and capable of providing a cured product with excellent properties. SOLUTION: This epoxy resin composition comprises an epoxy resin and a latent curing agent having a ketimine group and an oxazolidine group in the molecule.
申请公布号 JP2002206020(A) 申请公布日期 2002.07.26
申请号 JP20010346136 申请日期 2001.11.12
申请人 SANYO CHEM IND LTD 发明人 SAITO HIDEAKI
分类号 C08G59/40;(IPC1-7):C08G59/40 主分类号 C08G59/40
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