| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing semiconductor, having excellent strength at the heated time, having excellent adhesion to various kinds of members such as a semiconductor element and a lead frame, and excellent solder resistance when the member is mounted on a substrate, especially at a solder-treating temperature higher than that in a conventional method, and further having excellent adhesion to a pre-plating frame of Ni, Ni-Pd, Ni-Pd-Au or the like. SOLUTION: This epoxy resin composition for sealing the semiconductor is characterized in that the composition consists essentially of (A) an epoxy resin, (B) a phenol resin, (C) an organic compound having a silanol group and an isocyanate group in the same molecule, and/or a hydrolyzed product of the organic compound, (D) an inorganic filler and (E) a curing accelerator.
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