| 摘要 |
PROBLEM TO BE SOLVED: To suppress distortions and cracks of a substrate loaded with chips, by holding at the time of holding the substrate loaded with electronic device chips on a heat radiating plate. SOLUTION: By using magnetic force acting between the permanent magnet 42 of a holding member 40 and a yoke member 44, the substrate 20 loaded with the electronic device chips 10 and 12 is held on the heat radiation plate 30. By holding it in such a manner, the substrate 20 loaded with the chips is held on the heat radiation plate 30, even without having to apply high pressurize on the substrate 20 loaded with the chips. As a result, distortions and the cracks to be generated on the substrate 20 loaded with the chips are suppressed. |
