发明名称 SUBSTRATE TREATING METHOD AND SUBSTRATE TREATMENT DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a substrate treating method and a substrate treatment device, which can securely dry a substrate after a reactive product and an organic matter are removed. SOLUTION: The substrate treatment device is provided with an indexer part 4 for carrying in a cassette 7 where the substrate W is stored, a heat treating part 1 heating the substrate W, a cooling treating part 2 cooling the substrate W, a spin treating part 3 having a spin chuck holding the substrate W so that it can rotate, a removal liquid supply mechanism supply removal liquid to the surface of the substrate W and a pure water supply mechanism supplying pure water to the surface of the substrate W, and a pair of transportation mechanisms 5 and 6 which sequentially transport the substrate W to the spin treating part 3, the heating processing part 1 and the cooling treating part 2 from the indexer part 4.
申请公布号 JP2002208578(A) 申请公布日期 2002.07.26
申请号 JP20010330675 申请日期 2001.10.29
申请人 DAINIPPON SCREEN MFG CO LTD 发明人 SUGIMOTO HIROAKI;OKUDA SEIICHIRO;KURODA TAKUYA
分类号 G03F7/42;H01L21/027;H01L21/302;H01L21/304;H01L21/3065;(IPC1-7):H01L21/304;H01L21/306 主分类号 G03F7/42
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