发明名称 MODULE CIRCUIT DEVICE AND SHEATHING CASE THEREOF
摘要 PROBLEM TO BE SOLVED: To enable a module circuit device to be improved in production efficiency and reduced in production cost by decreasing component parts in number, and to improve a sheathing case in housing space-saving properties so as to provide the module circuit device and its sheathing case which are reduced in size as much as possible. SOLUTION: A module circuit device is composed of a base 1 where a coil T is provided and a cover 2 which covers the base 1, and a press support 3 that pinches the core K of the coil T is provided to either the base 1 or the cover 2. The press support 3 is formed of a single spring or a plurality of springs which hold the core K of the coil T by pressing it against the inner wall of the base 1 or the cover 22.
申请公布号 JP2002208517(A) 申请公布日期 2002.07.26
申请号 JP20010001216 申请日期 2001.01.09
申请人 DENSEI LAMBDA KK 发明人 FUKAGAWA HIROSHI;HAYASHI TOMOYUKI
分类号 H05K7/12;H01F27/02;H01F27/06;H03H7/09;(IPC1-7):H01F27/02 主分类号 H05K7/12
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