发明名称 |
MODULE CIRCUIT DEVICE AND SHEATHING CASE THEREOF |
摘要 |
PROBLEM TO BE SOLVED: To enable a module circuit device to be improved in production efficiency and reduced in production cost by decreasing component parts in number, and to improve a sheathing case in housing space-saving properties so as to provide the module circuit device and its sheathing case which are reduced in size as much as possible. SOLUTION: A module circuit device is composed of a base 1 where a coil T is provided and a cover 2 which covers the base 1, and a press support 3 that pinches the core K of the coil T is provided to either the base 1 or the cover 2. The press support 3 is formed of a single spring or a plurality of springs which hold the core K of the coil T by pressing it against the inner wall of the base 1 or the cover 22.
|
申请公布号 |
JP2002208517(A) |
申请公布日期 |
2002.07.26 |
申请号 |
JP20010001216 |
申请日期 |
2001.01.09 |
申请人 |
DENSEI LAMBDA KK |
发明人 |
FUKAGAWA HIROSHI;HAYASHI TOMOYUKI |
分类号 |
H05K7/12;H01F27/02;H01F27/06;H03H7/09;(IPC1-7):H01F27/02 |
主分类号 |
H05K7/12 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|