| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device and a manufacturing method thereof which prevents a protective member for avoiding damage on a semiconductor element from developing the lens effect in a resin package. SOLUTION: The semiconductor device comprises a first inner lead which mounts a semiconductor element, a second inner lead conductively connected to the semiconductor element through a wire, and a resin package formed so as to seal the semiconductor element and the wire therein. In the resin package, the first and second inner leads, the semiconductor element and the wire are coated with a film containing an amorphous fluororesin. |
