MOUNTING BOARD AND MODULE FOR ELECTRONIC ELEMENT CHIP

摘要

PROBLEM TO BE SOLVED: To suppress thermal stresses generated at the connecting part of an insulator board to a metal board. SOLUTION: A mounting board 10 is formed by connecting metal boards 14, to both surfaces of an insulator board 12 formed of an aluminum nitride. The board 14 is formed of a material, in which aluminum nitride particles having a particle size of about 2 to 10μm of a prescribed amount are dispersed in a base material of aluminum. In this way, difference in the thermal expansions between the board 14 and the board 12 is reduced, and a thermal stress at the connecting part of the board 14 to the board 12 is suppressed. As a result, peeling of the boards 12 and 14 or a crack of the connecting part can be suppressed.