| 摘要 |
PROBLEM TO BE SOLVED: To provide a small-sized, highly reliable semiconductor device in which many electronic circuits are formed in a highly integrated manner at a high density in a small area, and a wire is precisely jointed to the electrode pad of a semiconductor element. SOLUTION: This semiconductor device 7 is composed of an external terminal 4, base body 1, first semiconductor element 2 arranged on the base body 1 and provided with a plurality of first electrode pads 2a on an upper surface, second semiconductor element 3 arranged on the first semiconductor element 2 and provided with a plurality of second electrode pads 3a on the upper surface, wire 5 electrically connecting the first electrode pads 2a and second electrode pads 3a of the first semiconductor element 2 and the second semiconductor element 3 and the external terminal 4, and resin-coating material 6 coating the first semiconductor element 2 and the second semiconductor element 3. If the external dimensions of the first semiconductor element and the second semiconductor element are defined respectively as T1 and T2, then T1>T2 and 40>=T1-T2>=1.3 (mm) hold. |
