发明名称 HIGH-G MOUNTING ARRANGEMENT FOR ELECTRONIC CHIP CARRIER
摘要 <p>A chip carrier (20) is coupled to a printed circuit board (22) by leads (24) so that the chip carrier (20) stands off from the printed circuit board (22). A spacer (26) is provided between the chip carrier (20) and the printed circuit board (22). The spacer (26) reduces g forces on the leads(24).</p>
申请公布号 WO2002058444(A2) 申请公布日期 2002.07.25
申请号 US2002001015 申请日期 2002.01.14
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