发明名称 |
Pin standing resin-made substrate, method of making pin standing resin-made substrate, pin and method of making pin |
摘要 |
A pin standing resin substrate comprises: a resin substrate having a substantially plate-shaped main surface and comprising one of a resin and a composite material containing a resin, with a pin-pad exposed from the main surface; and a pin solder-jointed to the pin-pad, wherein the pin has been subjected to thermal treatment so as to soften the pin, and comprises a rod-like portion and an enlarged diameter portion having the same material as the rod-like portion, the enlarged diameter portion having a larger diameter than the rod-like portion and being formed at one end of the rod-like portion, and at least the enlarged diameter portion is soldered to the pin-pad.
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申请公布号 |
US2002096361(A1) |
申请公布日期 |
2002.07.25 |
申请号 |
US20010829438 |
申请日期 |
2001.04.10 |
申请人 |
SAIKI HAJIME;MIYAMOTO NORITAKA |
发明人 |
SAIKI HAJIME;MIYAMOTO NORITAKA |
分类号 |
B23K1/20;H01L23/498;H01R12/57;H05K3/34;(IPC1-7):H05K1/11;H01R12/04 |
主分类号 |
B23K1/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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