| 发明名称 |
Verfahren zum Vereinzeln von Wafern in Chips |
| 摘要 |
The invention relates to a method for subdividing a wafer (1) into chips. To this end, the wafer is provided on its back (6) with recesses (7) that weaken the wafer (1) in the points of fracture, thereby allowing for the production of chips whose longitudinal dimensions are smaller than double the thickness of the chips.
|
| 申请公布号 |
DE10101737(A1) |
申请公布日期 |
2002.07.25 |
| 申请号 |
DE20011001737 |
申请日期 |
2001.01.16 |
| 申请人 |
OSRAM OPTO SEMICONDUCTORS GMBH & CO. OHG |
发明人 |
KUEHN, FRANK;GOELTL, CLAUDIA |
| 分类号 |
H01L21/00;H01L21/301;H01L21/78;H01L33/00;(IPC1-7):H01L21/301 |
主分类号 |
H01L21/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
