| 摘要 |
PURPOSE:To facilitate uniform coating of adhesive and improve the quality of die-bonding in the assembly process of a semiconductor device. CONSTITUTION:Adhesive 2 is contained in a syringe which is supported so as to ascend and descend freely, and it is applied to an object 1 from a nozzle 3 attached to the bottom end of the syringe. The nozzle 3 has flat parts 3a and grooves 3b on its lower end part and an outlet 3c is provided in the grooves 3b. With this apparatus, the adhesive 2 is supplied from the outlet 3c in such a manner that the grooves 3b are filled with the adhesive 2 while the flat parts 3a of the nozzle 3 are brought into tight contact with the object 1. Or the flat parts 3a of the nozzle 3 are brought into tight contact with the object 1 and then lowered a little to form a gap between the flat part 3a and the object 1 and, in this state, the adhesive 2 is supplied from the outlet 3c so as to fill the gap and the grooves 3b. Even if voids exist in the nozzle 3, they have little influence upon the uniformity of coating.
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