发明名称 |
CONTACT PADS AND CIRCUIT BOARDS INCORPORATING SAME |
摘要 |
<p>A contact pad (12) for a circuit board (8) including a central portion and a plurality of spokes extending from the central portion. A circuit board (8) includes a nonconductive substrate; a plurality of electrically conductive contact pads (12), each of the contact pads (12) having a central portion; and a plurality of spokes extending from the central portion, and an electrically conductive trace (10) interconnecting the contact pads.</p> |
申请公布号 |
WO02058443(A1) |
申请公布日期 |
2002.07.25 |
申请号 |
WO2002US00334 |
申请日期 |
2002.01.09 |
申请人 |
DELAWARE CAPITAL FORMATION, INC. |
发明人 |
PRIMAVERA, TONY |
分类号 |
H05K1/11;H05K3/34;(IPC1-7):H05K1/18 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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