发明名称 CONTACT PADS AND CIRCUIT BOARDS INCORPORATING SAME
摘要 <p>A contact pad (12) for a circuit board (8) including a central portion and a plurality of spokes extending from the central portion. A circuit board (8) includes a nonconductive substrate; a plurality of electrically conductive contact pads (12), each of the contact pads (12) having a central portion; and a plurality of spokes extending from the central portion, and an electrically conductive trace (10) interconnecting the contact pads.</p>
申请公布号 WO02058443(A1) 申请公布日期 2002.07.25
申请号 WO2002US00334 申请日期 2002.01.09
申请人 DELAWARE CAPITAL FORMATION, INC. 发明人 PRIMAVERA, TONY
分类号 H05K1/11;H05K3/34;(IPC1-7):H05K1/18 主分类号 H05K1/11
代理机构 代理人
主权项
地址