| 摘要 |
<p>A film made of a resin composition comprising 100 parts by weight of a mixture of a crystalline polyaryl ether ketone resin (A) with a noncrystalline polyether imide resin (B) and 5 to 50 parts by weight of a filler, characterized by satisfying the relationship: Tc(A) < Tc(A + B) ≤ Tg(B) + 20 [wherein Tc (A + B) is the crystallization peak temperature (°C) of the film as determined by differential scanning calorimetry at a temperature rise rate of 10 °C/min; Tc(A) is the crystallization peak temperature (°C) of the resin (A); and Tg(B) is the glass transition temperature (°C) of a film made of the resin (B)]. This film and laminates produced by laminating the film with metal are excellent in tear resistance, dimensional stability, and so on, and suitable for members of electronic components.</p> |
