发明名称 SPLITTING METHOD OF BRITTLE MATERIAL
摘要 PURPOSE:To elevate a generating rate of initial crack at machining start point and to improve the machining speed and precision in executing splitting of brittle material with use of laser beam. CONSTITUTION:Generation of an initial crack C is executed while simultaneously irradiating two positions P1, P2 at least near the edge of a work W with laser beam, successively, while plural irradiating positions S1, S2 are controlled to the prescribed position relationship or a laser output of irradiating positions S1, S2 is controlled, the laser beam is traveled along a splitting planned line L, crack C is induced. By this method, peculiar heat stress distribution is generated between laser beam irradiating positions, its tensile stress is made larger as compared to that of irradiation of one point laser beam, splitting control is improved by controlling the generating state of stress.
申请公布号 JPH07328781(A) 申请公布日期 1995.12.19
申请号 JP19940126146 申请日期 1994.06.08
申请人 SOUEI TSUSHO KK;NAGASAKI PREF GOV;RES DEV CORP OF JAPAN 发明人 MORITA HIDEKI;MAEKAWA SHUNICHI;OKIYAMA TOSHIHIRO;SHIRAHAMA HIDEYUKI;YOKOYAMA TOSHIYUKI;OONITA EISHIN
分类号 B23K26/00;B23K26/06;B23K26/067;B23K26/40;H05K3/00 主分类号 B23K26/00
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