| 摘要 |
A semiconductor device in accordance with the present invention is a semiconductor device using TCP structure, including a first semiconductor chip mounted on a tape carrier by ILB and a second semiconductor chip mounted on the tape carrier via the first semiconductor chip. The first semiconductor chip is arranged so that a first electrode, formed on a surface of the first semiconductor chip for an electrode, is connected to an inner lead via a gold bump, whereas the second semiconductor chip is arranged so that an electrode thereof is connected to a second electrode formed on that surface via a gold bump. On this account, it is possible to reduce a terminal pitch of the semiconductor device on which more than one semiconductor chip are mounted.
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