发明名称 |
CUTTING TOOL COATED WITH DIAMOND |
摘要 |
A cutting tool coated with diamond in which diamond is coated as a film on a substrate having a step 15 to 500 mum in height in the vicinity of a cutting edge on the rake surface and/or the flank surface. Only the diamond film in the vicinity of the cutting edge can be polished first, without polishing the film of the diamond formed centrally of the rake surface and/or the flank surface. This enables the maximum effect (sharpening of the cutting edge and prevention of welding formation at cutting edge) to be realized with the necessary minimum polishing (with a decreased polishing removal), without setting special conditions and which is suited as a finishing tool.
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申请公布号 |
US2002098360(A1) |
申请公布日期 |
2002.07.25 |
申请号 |
US19990470732 |
申请日期 |
1999.12.22 |
申请人 |
OKAMURA TAKASHI;IIO SATOSHI |
发明人 |
OKAMURA TAKASHI;IIO SATOSHI |
分类号 |
B23C5/16;B23B27/14;B23B27/20;C23C16/27;(IPC1-7):B32B9/00 |
主分类号 |
B23C5/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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