发明名称 METHOD AND APPARATURS FOR TREATING SUBSTRATE
摘要 <p>A method of treating a substrate which comprises forming an interlayer insulating layer through application and irradiating the layer with an electron ray in a treatment chamber, thereby curing the interlayer insulating layer. The method allows an interlayer insulating layer to be cured in a markedly shorter time than that required for a conventional method.</p>
申请公布号 WO2002058128(P1) 申请公布日期 2002.07.25
申请号 JP2002000268 申请日期 2002.01.17
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