Manufacturing method for system carrier for IC chip has circuit board fitted in opening in system carrier with its conductor paths termination contacts coupled directly to electrical leads around opening periphery

摘要

The manufacturing method has a circuit board (10) fitted into an opening in the system carrier, so that termination contacts (14) of the circuit board conductor paths (12) and corresponding electrical leads (4) around the periphery of the opening overlap, for direct connection with one another. Each of the termination contacts is provided with a hole through which the inner end (5) of the corresponding electrical lead is fitted after bending through 90 degrees.