SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

摘要

In a semiconductor device inclusive of a chip size package, a plurality of slits 6A are formed in a wiring layer 6. The slits 6A each having a rectangular shape are arranged so that their longer sides are extended along the direction of extending the wiring layer 6. In this configuration, the stress to be exerted on the wiring layer can be relaxed, thereby preventing the characteristic of the underlying transistor from being deteriorated.