MASK FOR REMOVING DREG OF MOLDING RESIN

摘要

PURPOSE: A mask for removing the dreg of molding resin is provided to effectively remove the dreg of the molding resin by irradiating a laser beam to the area of the dreg exposed through the hole of a mask. CONSTITUTION: A mask is a stencil having a specific thickness. Holes are formed in the mask. The mask is covered on a semiconductor package(100). Then, the bottom surface of a chip-board(18) is exposed through the holes. A laser deflasher(16) is placed on the central portion of a lead frame. A laser beam is irradiated toward the chip-board from the laser deflasher. The dreg of the molding resin in the chip-board is removed by the laser beam.