COMPONENT BUILT-IN MODULE AND METHOD OF MANUFACTURING THE SAME

摘要

PURPOSE: A component built-in module and a method of manufacturing the same are provided to achieve high reliability and allow for high-density component-mounting. CONSTITUTION: A component built-in module comprises an electric insulation layer(101), first wiring patterns(102a,102b) in a plurality of layers which are laminated with the electric insulation layer being interposed therebetween, at least one first inner via(104) electrically connecting the first wiring patterns in different layers with each other, and a semiconductor(103) embedded in the electric insulation layer and mounted on any one of the first wiring patterns in the plurality of layers. At least one of the first inner vias is present in a range that overlaps a range in which the electronic component is present in a lamination direction in which the first wiring patterns are laminated, and has a height in the lamination direction that is smaller than a height of the electronic component.