| 摘要 |
A structure of stacked integrated circuits arranged on a circuit board includes a substrate, a lower integrated circuit, a plurality of wirings, a passivation layer, and an upper integrated circuit. The substrate has a first surface formed with signal input terminals, and a second surface formed with signal output terminals for electrically connecting to the circuit board. The lower integrated circuit has a first surface and a second surface. The first surface of the lower integrated circuit is adhered onto the first surface of the substrate. The second surface of the lower integrated circuit is formed with a plurality of bonding pads. The wirings each includes a first end and a second end opposite to the first end. The first ends of the wirings are electrically connected to the bonding pads of the lower integrated circuit, and the second ends of the wirings are electrically connected to the signal input terminals of the substrate, respectively. The passivation layer is coated on the second surface of the lower integrated circuit for sealing the plurality of wirings. The upper integrated circuit is adhered on the passivation layer to form a stack with the lower integrated circuit. According to the structure, the wirings are free from being pressed by the upper integrated circuit, the stacking processes can be facilitated, and the manufacturing costs can be effectively lowered.
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