| 摘要 |
A semiconductor device in which a plurality of semiconductor chips are stacked. The semiconductor device comprises: a lower side semiconductor chip bonded onto a surface of a wiring substrate; an upper side semiconductor chip; and one or more spacers which are bonded onto the surface of the wiring substrate and which support the upper side semiconductor chip over the lower side semiconductor chip and at a location separated from the lower side semiconductor chip. The upper side semiconductor chip and the lower side semiconductor chip are electrically coupled with the wiring substrate, and whole components on the wiring substrate are encapsulated by an encapsulating resin. The size of the upper side semiconductor chip can be larger than that of the lower side semiconductor chip.
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