| 摘要 |
<p>The present provides an epoxy resin composition for semiconductor encapsulation, which has a low melt viscosity, is excellent in storage stability and moldability, and gives a cured product having excellent solder crack resistance. Said epoxy resin composition comprises, as essential components: (a) as an epoxy resin, a biphenol type epoxy resin represented by general formula (I) (where R1-R8 represent hydrogen, an alkyl group, a phenyl group, an aralkyl group, or an alkoxyl group, and n is 0-5); (b) as a phenol type hardener, a thiodiphenol compound represented by general formula (II) and a polyhydric phenol compound having a structure other than the thiodiphenol compound (where X represents an alkyl group, a phenyl group, an aralkyl group, or an alkoxyl group, and m is 0-3); (c) an inorganic filler; and (d) a curing accelerator.</p> |
