SEMICONDUCTOR FABRICATING APPARATUS FOR ELIMINATING WAFER PROTECTING TAPE

摘要

PURPOSE: A semiconductor fabricating apparatus for eliminating wafer protecting tape is provided to reduce fabricating cost for purchasing a raw material, by eliminating the need to use additional removal tape in removing protection tape after a process for polishing a wafer is performed. CONSTITUTION: A pattern for forming an electronic circuit is formed on the wafer(110). An absorbing unit applies vacuum absorbing force to a part of the protection tape(120) attached to a surface of the wafer so that a part of the protection tape is dropped to the surface of the wafer. A peeling apparatus(300) presses the upper and lower surfaces of the protection tape separated from the absorbing unit and peels the rest of the protection tape from the surface of the wafer.