发明名称 PAD ARRANGEMENT STRUCTURE OF SEMICONDUCTOR MEMORY DEVICE AND DRIVING METHOD THEREOF
摘要 PURPOSE: A pad arrangement structure of a semiconductor memory device and a driving method thereof are provided, which reduces a data path by arranging a control pad and an input/output pad dispersively. CONSTITUTION: According to the semiconductor memory device comprising a number of memory banks(BA21-BA22) arranged on a cell region of a memory chip(20) and a number of control pads(CPAD2) to read/write data of the memory bank and a number of input/output pads, the above control pads and the above input/output pads are arranged on a peripheral region between memory banks and on an outer part of each memory bank dispersively. The control pads are arranged in a line on the peripheral region of the memory chip, and the input/output pads are arranged on the outer part of the memory banks.
申请公布号 KR20020061872(A) 申请公布日期 2002.07.25
申请号 KR20010002951 申请日期 2001.01.18
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 AHN, MI HYEON;LEE, JEONG BAE
分类号 G11C7/00;G11C5/02;H01L23/50;(IPC1-7):G11C7/00 主分类号 G11C7/00
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