发明名称 |
PAD ARRANGEMENT STRUCTURE OF SEMICONDUCTOR MEMORY DEVICE AND DRIVING METHOD THEREOF |
摘要 |
PURPOSE: A pad arrangement structure of a semiconductor memory device and a driving method thereof are provided, which reduces a data path by arranging a control pad and an input/output pad dispersively. CONSTITUTION: According to the semiconductor memory device comprising a number of memory banks(BA21-BA22) arranged on a cell region of a memory chip(20) and a number of control pads(CPAD2) to read/write data of the memory bank and a number of input/output pads, the above control pads and the above input/output pads are arranged on a peripheral region between memory banks and on an outer part of each memory bank dispersively. The control pads are arranged in a line on the peripheral region of the memory chip, and the input/output pads are arranged on the outer part of the memory banks. |
申请公布号 |
KR20020061872(A) |
申请公布日期 |
2002.07.25 |
申请号 |
KR20010002951 |
申请日期 |
2001.01.18 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
AHN, MI HYEON;LEE, JEONG BAE |
分类号 |
G11C7/00;G11C5/02;H01L23/50;(IPC1-7):G11C7/00 |
主分类号 |
G11C7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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