A PACKAGING AND INTERCONNECT SYSTEM FOR FIBER AND OPTOELECTRONIC COMPONENTS

摘要

A packaging system for optical or optoelectronic devices having a first package of micromachined material having at least one male connection component and a second package of micromachined material having at least one female component, wherein the male connection component is configured to mate with the female connection component. A mating surface of the male component and the female component has V-grooves designed to accept a first optical fiber and a second optical fiber, wherein the first V-groove (3) is configured to align with the second V-groove (6) when the first package and second package mate, thereby passively aligning the first optical fiber (4) with the second optical fiber (8) to form a high quality fiber butt joint. Alternatively, the female component is configured to accept a photodetector, wherein the first V-groove and second V-groove passively align the first optical fiber with the photodetector.