WAFER SUPPORTING CHUCK OF APPARATUS FOR FABRICATING SEMICONDUCTOR AND FABRICATING METHOD THEREOF

摘要

PURPOSE: A wafer supporting chuck of an apparatus for fabricating a semiconductor is provided to improve wafer processing efficiency, by supplying heat of considerably high uniformity regarding the entire wafer. CONSTITUTION: A heat generating source(120) is installed in the inside of a housing. A wafer is settled on a settle table settled on the housing. The settle table includes the first plate member(210) and the second plate member(220) which are made of different materials. The first plate member is installed in the open portion of the upper portion of the housing. The second plate member is piled up on the first plate member.