| 摘要 |
PURPOSE: To connect input/output terminals firmly by soldering by providing connecting wirings which connect soldering pads and the exposed surfaces of via holes. and dams which prevent soldering material from flowing to parts being just above the exposed surfaces of the via holes of the connecting wirings. CONSTITUTION: Soldering pads 3 composed of thin-film layers 3A and plated layers 3B, and connecting wirings 4 composed of thin-film layers 4A and plated layers 4B similarly are formed on a board surface 1A. The soldering pads 3 are formed on the board 1A apart from the exposed surfaces 2A of via holes, and connecting wirings 4 are formed so as to cover the exposed surfaces 2A of the via holes 2A, and to connect the pads 3 with the exposed surfaces 2A. Following this, dams 5 of a thickness 20μm are formed by applying glass paste to the circumferential hems of the pads, and onto the connecting wirings 4 and the exposed board surface IA and performing burning. The dams 5 repel soldering material, and prevent the soldering material from spreading over to the circumferential hems and onto the connecting wirings.
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